Laser Etching Effect on Application Mode of Universal Adhesive

Conditions

• Healthy Participant

Interventions

• PROCEDURE: Total-etch mode with 35% phosphoric acid (K-ETCHANT) (TE-A group)
• PROCEDURE: Selective-etch mode with 35% phosphoric acid (K-ETCHANT) (SE-A group)
• PROCEDURE: Total-etch mode with Er, Cr: YSGG laser (Waterlase MD) (TE-L group)
• PROCEDURE: Selective-etch mode with Er, Cr: YSGG laser (Waterlase MD) (SE-L group).
• PROCEDURE: Self-etch mode Clearfil Universal Bond Quick (Kuraray, Japan) (SE group)

Sponsor

Hacettepe University