# Reliable Miniature Implantable Connectors with High Channel Density for Advanced Neural-Interface Applications

> **NIH NIH R21** · UNIVERSITY OF FLORIDA · 2020 · $184,392

## Abstract

PROJECT SUMMARY:
For patients to benefit from state-of-the-art high-channel-count neural-interface technology, translatable implant
packaging technology is needed to support it. Despite advances in implant electronics, batteries, enclosures, and even
high-feedthrough-count and high-feedthrough-density headers, the lack of advancement in implant connector technology
has imposed an often-unacceptable tradeoff between high interface channel count and the ability to disconnect and
reconnect implanted interface leads from packaged and implanted electronics. Specifically, it would be of great value to
enable battery changes, implant electronics replacement, or implant electronics upgrades to be performed without
disturbing high-channel-count thin-film interfaces that have become integrated into delicate and sensitive neural tissue.
We propose to revolutionize implantable connector technology by creating miniature, reliable, and high-channel-density
connectors for high-channel-count neural interfaces produced with thin-film microfabrication technology. To do this we
will advance and miniaturize three critical connector components: (1) the gaskets used to reliably achieve and maintain
high channel density and channel-to-channel isolation even without hermeticity; (2) the conductive spring elements in
each via used to reliably achieve and maintain low-resistance contacts; and (3) a compact and easy-to-use mechanical
mechanism to achieve and maintain a high-clamping force for sealing to the gasket and engaging the conductive springs
between all contacts. In Specific Aim 1 we propose to develop and characterize the performance and reliability of a
miniaturized thin-film implant-gasket technology so that higher channel densities are possible in implantable connectors
without compromising channel-to-channel isolation. In Specific Aim 2 we propose to develop and characterize the
performance and reliability of multi-point low-impedance electrical contacts between high-channel-density interface leads
and high-feedthrough-density implant-packaging headers. To mitigate risk, we will explore three different approaches.
First, we will pattern gaskets or fill gasket vias with a dense mixture of conductive metal particles and PDMS. Second,
inspired by the mm-scale packaging technology called fuzz buttons, we will microfabricate fuzz buttons that consist of a
dense mat of electrospun microfibers that can be patterned directly on top of the Pt vias in the ceramic header, pyrolyzed,
and then coated with metal. Third, we will microfabricate multiple stress-engineered upward-curling microcantilever
springs on top of each feedthrough of the ceramic-Pt substrate. Each approach is designed to achieve multiple points of
contact for low impedance and a restoring spring force to maintain electrical connection spanning the gasket over time. In
Specific Aim 3 we propose to develop and characterize the performance and reliability of the clamping mechanism
needed to deliver enough f...

## Key facts

- **NIH application ID:** 9861242
- **Project number:** 5R21EB028079-02
- **Recipient organization:** UNIVERSITY OF FLORIDA
- **Principal Investigator:** Jack W Judy
- **Activity code:** R21 (R01, R21, SBIR, etc.)
- **Funding institute:** NIH
- **Fiscal year:** 2020
- **Award amount:** $184,392
- **Award type:** 5
- **Project period:** 2019-03-01 → 2021-12-31

## Primary source

NIH RePORTER: https://reporter.nih.gov/project-details/9861242

## Citation

> US National Institutes of Health, RePORTER application 9861242, Reliable Miniature Implantable Connectors with High Channel Density for Advanced Neural-Interface Applications (5R21EB028079-02). Retrieved via AI Analytics 2026-05-25 from https://api.ai-analytics.org/grant/nih/9861242. Licensed CC0.

---

*[NIH grants dataset](/datasets/nih-grants) · CC0 1.0*