# FMSG: Cyber: Molecular Layer Deposition for EUV Photoresists

> **NSF 01002526DB NSF RESEARCH & RELATED ACTIVIT** · University of Washington (WA) · $500,000

## Abstract

This project aims to help advance the field of semiconductor manufacturing by addressing a critical challenge in extreme ultraviolet (EUV) photolithography, a technology essential for creating the next generation of integrated circuits with features smaller than 10 nanometers. EUV photolithography is a process used to pattern extremely small features on silicon wafers, which are the building blocks of electronic devices. In this project, development of new photoresists will be carried out. These photoresists are light-sensitive materials used to form a patterned coating on a surface. To develop these photoresists, fundamental studies will be performed to learn what chemical reactions take place when these photoresists are exposed to light. By improving these materials, the project seeks to enhance the effectiveness of EUV photolithography, thereby supporting the growth of the semiconductor industry. This advancement is crucial, as it will enable the production of smaller, faster, and more efficient electronic devices, which are in high demand in today's technology-driven world. Additionally, the project includes educational initiatives to inspire and prepare students for careers in the semiconductor industry. These efforts align with the goals of the US CHIPS Act, which aims to strengthen the domestic semiconductor workforce.

During the two-year funding period, this proposed research will uncover the mechanisms behind the crosslinking and chemical etching of ultrathin pho

## Key facts

- **NSF award ID:** 2427975
- **Awardee organization:** University of Washington (WA)
- **SAM.gov UEI:** HD1WMN6945W6
- **PI:** David S Bergsman
- **Primary program:** 01002526DB NSF RESEARCH & RELATED ACTIVIT
- **All programs:** NANO NON-SOLIC SCI & ENG AWD, Microelectronics and Semiconductors, Sustainable Materials, Nanoscale Devices and Systems
- **Estimated total:** $500,000
- **Funds obligated:** $500,000
- **Transaction type:** Standard Grant
- **Period:** 06/01/2025 → 05/31/2027

## Primary source

NSF Award Search: https://www.nsf.gov/awardsearch/showAward?AWD_ID=2427975

## Citation

> US National Science Foundation, Award 2427975, FMSG: Cyber: Molecular Layer Deposition for EUV Photoresists. Retrieved via AI Analytics 2026-06-08 from https://api.ai-analytics.org/grant/nsf/2427975. Licensed CC0.

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