# ERI: Exploration of an Accurate and Efficient Reliability Modeling Technique for Semiconductor Packages Subjected to Dynamic Excitation

> **NSF 01002526DB NSF RESEARCH & RELATED ACTIVIT** · Lamar University (TX) · $198,456

## Abstract

This Engineering Research Initiation (ERI) award supports research to enhance national prosperity and security by developing reliability modeling techniques for electronic packages in harsh environments characterized by extreme temperatures, humidity, mechanical shocks, and vibrations. Vibrations are an important problem for semiconductor packages deployed in the railroad, transport, and defense industries, where the extreme vibrations will cause semiconductor packages to fail at low stress cycles, resulting in isothermal fatigue and altering the dynamic behavior of the package. This award pursues a fundamental understanding of how package dynamics change as input excitation increases and how these changes can be modeled effectively to predict the service life and assess potential damage within the packages. The project will integrate research efforts with education and outreach initiatives, providing new research opportunities in structural dynamics for undergraduate students, as well as outreach activities to the semiconductor industry.

The project seeks to develop a new framework, theory, and methods to effectively and efficiently model the reliability of electronic packages under dynamic excitation. This effort leverages a phase-locked loop control algorithm and a novel accelerated testing approach to create a  pseudo-nonlinear dynamic model of the packages. The nonlinear stress and strain responses will be derived from this researched model to infer the service life o

## Key facts

- **NSF award ID:** 2501872
- **Awardee organization:** Lamar University (TX)
- **SAM.gov UEI:** MEYGUN6CCN16
- **PI:** Sushil Doranga
- **Primary program:** 01002526DB NSF RESEARCH & RELATED ACTIVIT
- **All programs:** SIMULATION MODELS, Manufacturing, RESEARCH INITIATION AWARD
- **Estimated total:** $198,456
- **Funds obligated:** $198,456
- **Transaction type:** Standard Grant
- **Period:** 06/15/2025 → 05/31/2027

## Primary source

NSF Award Search: https://www.nsf.gov/awardsearch/showAward?AWD_ID=2501872

## Citation

> US National Science Foundation, Award 2501872, ERI: Exploration of an Accurate and Efficient Reliability Modeling Technique for Semiconductor Packages Subjected to Dynamic Excitation. Retrieved via AI Analytics 2026-06-07 from https://api.ai-analytics.org/grant/nsf/2501872. Licensed CC0.

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