The strength of solder joints can be reduced by pores caused by bubbles trapped during the soldering process. Small bubbles are especially likely to be trapped because their buoyancy is relatively weak, especially in reduced-gravity environments; hence, they do not quickly rise to the surface. This research project will explore acoustic waves as a means of quickly expelling small bubbles from molten solder. Acoustic methods have been used successfully in other situations, e.g. to remove bubbles from cell culture media. This project will transplant those methods to molten solder. Experiments in microgravity will allow acoustically driven bubble motion to be isolated from the effects of buoyancy-driven motion. These data will be used to validate simulations of bubble motion and improve future predictions of the same. The results look to speed up soldering operations and reduce the heat energy needed to keep the solder molten. Additional benefits will come from training next-generation aerospace and mechanical engineers. Experiments in space research provide excellent outreach opportunities targeting high-school students. This project aims to develop an acoustics-assisted soldering technique and identify the optimal acoustic parameters (e.g., power, frequency, and activation duration) for effective bubble removal. An acoustic transducer will be used to generate waves within molten solder, actively displacing bubbles. This looks to significantly improve the mechanical strength