{"url_path":"/sec/ttmi/8-k/2026-06-03/item-1-02","section_key":"item-1-02","section_title":"Item 1.02 Termination of a Material Definitive Agreement.","topic":"sec","document":{"doc_type":"8-K","doc_date":"2026-06-03","source_url":"https://www.sec.gov/Archives/edgar/data/1116942/0001193125-26-255711-index.html","accession_number":"0001193125-26-255711","cik":"0001116942","ticker":"TTMI","issuer_name":"TTM TECHNOLOGIES INC","edgar_url":"https://www.sec.gov/Archives/edgar/data/1116942/0001193125-26-255711-index.html","primary_entity_key":"0001116942","primary_entity_name":"TTM TECHNOLOGIES INC"},"word_count":196,"has_tables":true,"body_markdown":"Item 1.02.\n\nTermination of a Material Definitive Agreement.\n\nIn connection with the 2026 Credit Agreement, on June 1, 2026, the Company terminated (a) the Amended & Restated ABL Credit Agreement, dated as of May 30, 2023, by and among the Company, the several lenders from time to time parties thereto, JPMorgan Chase Bank, N.A., as Administrative Agent, Barclays Bank PLC, Bank of America, N.A. and Truist Securities, Inc. as Syndication Agents, and HSBC Securities (USA) Inc., as Documentation Agent, as amended by the First Amendment dated as of June 10, 2024 (the “U.S. ABL Credit Agreement”), and (b) the Amended & Restated Facility Agreement, dated as of June 14, 2023, by and among TTM Technologies China Limited and TTM Technologies Trading (Asia) Company Limited, as borrowers, TTM Technologies (Asia Pacific) Limited and other parties as guarantors, The Hong Kong and Shanghai Banking Corporation Limited and Barclays Bank PLC as original lenders, and The Hong Kong and Shanghai Banking Corporation Limited as arranger, facility agent, security trustee and issuing bank (the “Asia ABL Credit Agreement”), and repaid all obligations pursuant to the U.S. ABL Credit Agreement and the Asia ABL Credit Agreement.\n\nSection 2 - Financial Information"}