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Semiconductor Chips with Minimized Chip Package Size

USITC investigation 337-605 · Bond Return 1

Section 337 (unfair imports / IP)Concluded

Product

Certain Semiconductor Chips with Minimized Chip Package Size and Products Containing Same

Started

2012-01-27

Concluded

2012-05-16

Petition received

2012-01-27

The U.S. International Trade Commission investigates whether U.S. industries are harmed by unfairly traded imports. Antidumping/countervailing-duty cases address goods sold below fair value or subsidized by foreign governments; Section 337 cases address unfair import practices, primarily patent and other IP infringement.

Source: USITC Investigations Database System. License: CC0 1.0.