← OFLC disclosures
Packaging Development Engineering Manager
LCA (H-1B / H-1B1 / E-3) · I-200-25268-335991 · Certified · decided 2025-11-04
Employer
- Name
- IBM Corporation
- Location
- Durham, NC, UNITED STATES OF AMERICA
- FEIN
- 13-0871985
- NAICS
- 54151
Job
- Title
- Packaging Development Engineering Manager
- SOC
- 17-2199.06 — Microsystems Engineers
- Workers requested
- 1
- Worksite
- Hopewell Junction, NY
- Employment
- 2026-03-24 → 2029-03-23
Wage
- Offered
- $194,593.56 per year
- Prevailing wage
- $133,598 per Year
- Wage level
- Level IV
Representation
- Attorney
- Tina Peloquin
- Firm
- Fragomen, Del Rey, Bernsen & Loewy, LLP
Source
- Authoritative
- DOL Performance Data
- Filed
- FY2026 Q2
- Machine
- JSON-LD · Markdown