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Wafer Bonding and Debonding Engineer
LCA (H-1B / H-1B1 / E-3) · I-200-26016-567305 · Certified · decided 2026-01-26
Employer
- Name
- IBM Corporation
- Location
- Durham, NC, UNITED STATES OF AMERICA
- FEIN
- 13-0871985
- NAICS
- 54151
Job
- Title
- Wafer Bonding and Debonding Engineer
- SOC
- 17-2061.00 — Computer Hardware Engineers
- Workers requested
- 1
- Worksite
- Albany, NY
- Employment
- 2026-02-02 → 2029-02-01
Wage
- Offered
- $140,004 per year
- Prevailing wage
- $119,995 per Year
- Wage level
- Level II
Representation
- Attorney
- Tina Peloquin
- Firm
- Fragomen, Del Rey, Bernsen & Loewy, LLP
Source
- Authoritative
- DOL Performance Data
- Filed
- FY2026 Q2
- Machine
- JSON-LD · Markdown