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PACKAGING ENGINEER LAB LEADER

LCA (H-1B / H-1B1 / E-3) · I-200-26029-603961 · Certified · decided 2026-02-05

Employer

Name

ABBOTT LABORATORIES

Location

CHICAGO, IL, UNITED STATES OF AMERICA

FEIN

36-0698440

NAICS

3254

Job

Title

PACKAGING ENGINEER LAB LEADER

SOC

17-2112.00 — Industrial Engineers

Workers requested

1

Worksite

ABBOTT PARK, IL

Employment

2026-02-09 → 2029-02-08

Wage

Offered

$142,000–$162,000 per year

Prevailing wage

$120,370 per Year

Wage level

Level IV

Representation

Attorney

JORDAN BENDERSKY

Firm

HUSSAIN, BENDERSKY & LISTON L.L.C.

Source

Authoritative

DOL Performance Data

Filed

FY2026 Q2

Machine

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