# Director, Packaging Engineering
> **LCA (H-1B / H-1B1 / E-3)** labor certification — `I-200-26050-652172` · Certified · decided 2026-02-26
## Employer
- **Name:** Sandisk Technologies, Inc.
- **Location:** Milpitas, CA, UNITED STATES OF AMERICA
- **FEIN:** 99-1519948
- **NAICS:** 334112
## Job
- **Title:** Director, Packaging Engineering
- **SOC:** 17-2141.00 — Mechanical Engineers
- **Workers requested:** 1
- **Worksite:** Dublin, CA
- **Employment period:** 2026-07-27 → 2029-07-26
## Wage
- **Offered:** $185,869–$244,778 per year
- **Prevailing wage:** $175,157 per Year
- **Wage level:** Level IV
## Representation
- **Attorney:** Jeffrey Kikuta
- **Firm:** Fragomen, Del Rey, Bernsen & Loewy, LLP
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*Source: [DOL OFLC](https://www.dol.gov/agencies/eta/foreign-labor/performance) · AI Analytics · CC0 1.0*