← OFLC disclosures
Software Firmware Engineer 3
LCA (H-1B / H-1B1 / E-3) · I-200-26051-655592 · Certified · decided 2026-02-27
Employer
- Name
- HP Inc.
- Location
- Spring, TX, UNITED STATES OF AMERICA
- FEIN
- 94-1081436
- NAICS
- 334111
Job
- Title
- Software Firmware Engineer 3
- SOC
- 15-1252.00 — Software Developers
- Workers requested
- 1
- Worksite
- Boise, ID
- Employment
- 2026-08-14 → 2029-08-13
Wage
- Offered
- $100,027–$155,000 per year
- Prevailing wage
- $100,027 per Year
- Wage level
- Level II
Representation
- Attorney
- Brooke Schram
- Firm
- Fragomen, Del Rey, Bernsen & Loewy, LLP
Source
- Authoritative
- DOL Performance Data
- Filed
- FY2026 Q2
- Machine
- JSON-LD · Markdown