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Software Engineer, Tooling and Development Infrastructure

LCA (H-1B / H-1B1 / E-3) · I-200-26061-674777 · Certified · decided 2026-03-09

Employer

Name

HP Inc.

Location

Spring, TX, UNITED STATES OF AMERICA

FEIN

94-1081436

NAICS

334111

Job

Title

Software Engineer, Tooling and Development Infrastructure

SOC

15-1253.00 — Software Quality Assurance Analysts and Testers

Workers requested

1

Worksite

San Francisco, CA

Employment

2026-03-02 → 2029-03-01

Wage

Offered

$113,277–$185,000 per year

Prevailing wage

$113,277 per Year

Wage level

Level II

Representation

Attorney

Mayu Hirao

Firm

Fragomen, Del Rey, Bernsen & Loewy, LLP

Source

Authoritative

DOL Performance Data

Filed

FY2026 Q2

Machine

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