← OFLC disclosures
Packaging Engineer
LCA (H-1B / H-1B1 / E-3) · I-200-26063-678457 · Certified · decided 2026-03-11
Employer
- Name
- Intel Corporation
- Location
- Santa Clara, CA, UNITED STATES OF AMERICA
- FEIN
- 94-1672743
- NAICS
- 3344
Job
- Title
- Packaging Engineer
- SOC
- 17-2072.00 — Electronics Engineers, Except Computer
- Workers requested
- 1
- Worksite
- Chandler, AZ
- Employment
- 2026-09-01 → 2029-08-31
Wage
- Offered
- $145,810–$205,850 per year
- Prevailing wage
- $138,715 per Year
- Wage level
- Level III
Representation
- Attorney
- Hannah Jahn
- Firm
- Fragomen, Del Rey, Bernsen & Loewy, LLP
Source
- Authoritative
- DOL Performance Data
- Filed
- FY2026 Q2
- Machine
- JSON-LD · Markdown