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Executive Director, Software Engineering

LCA (H-1B / H-1B1 / E-3) · I-200-26071-698096 · Certified · decided 2026-03-19

Employer

Name
JPMorgan Chase & Co.
Location
Chicago, IL, UNITED STATES OF AMERICA
FEIN
13-2624428
NAICS
551112

Job

Title
Executive Director, Software Engineering
SOC
15-1252.00 — Software Developers
Workers requested
1
Worksite
Columbus, OH
Employment
2026-09-09 → 2029-09-08

Wage

Offered
$204,300 per year
Prevailing wage
$140,026 per Year
Wage level
Level IV

Representation

Attorney
Cheryl Kilborn
Firm
Berry Appleman & Leiden LLP

Source

Authoritative
DOL Performance Data
Filed
FY2026 Q2
Machine
JSON-LD · Markdown