← OFLC disclosures
Principal Engineer, Packaging Engineering
LCA (H-1B / H-1B1 / E-3) · I-200-26075-705970 · Certified · decided 2026-03-23
Employer
- Name
- Sandisk Technologies, Inc.
- Location
- Milpitas, CA, UNITED STATES OF AMERICA
- FEIN
- 99-1519948
- NAICS
- 334112
Job
- Title
- Principal Engineer, Packaging Engineering
- SOC
- 17-2112.00 — Industrial Engineers
- Workers requested
- 1
- Worksite
- Fremont, CA
- Employment
- 2026-08-23 → 2029-08-22
Wage
- Offered
- $170,248–$178,848 per year
- Prevailing wage
- $163,030 per Year
- Wage level
- Level IV
Representation
- Attorney
- Jeffrey Kikuta
- Firm
- Fragomen, Del Rey, Bernsen & Loewy, LLP
Source
- Authoritative
- DOL Performance Data
- Filed
- FY2026 Q2
- Machine
- JSON-LD · Markdown